Company

RF360 Singapore Pte., Ltd.

Job Area

Engineering Group, Engineering Group > Hardware Engineering

General Summary

As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements.

Minimum Qualifications

• Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field.
  
  
  

Job Summary

We are looking for a proactive and technically skilled Process Engineer to support backend wafer level manufacturing operations activities. This role requires hands-on involvement with production tools, troubleshooting equipment, process optimization, and vendor management. The ideal candidate will be responsible for sustaining critical processes, resolving production issues, and driving continuous improvement.

Key Responsibilities

Process Engineering (Primary responsibility)

• Lead and sustain backend processes including Tape Expansion, UV Curing and Taping.
• Perform hands-on troubleshooting of process related issues.
• Drive continuous improvement initiatives to reduce cycle time, improve yield, and lower operational costs.
• Drive permanent solutions to resolve chronic process and quality issues.
• Lead investigation for process quality escalation.
• Lead process buyoff and performance validation for new machines and technologies.
• Responsible for preparing the line for internal & external audits and follow-up actions
  
  
  

Project Leadership

• Lead cross-functional projects involving technology transfer, cost savings, and process enhancement.
• Coordinate with Technology Development and Process Integration teams for new product release / quality related matters Lynne.
  
  
  

Requirements

• Bachelor’s Degree in Mechanical, Manufacturing, or related Engineering discipline.
• Minimum 2 years of hands-on experience in semiconductor backend packaging specifically Tape Expansion, UV Cure, Taping, Reel-to-Reel processes.
• Strong knowledge of Wafer level Taping process
• Proficient in 5-Why Analysis, FMEA, Control Plan, OCAP, SPC, MSA , 8D report and 6 Sigma (Green Belt preferred).
• Excellent communication and interpersonal skills; able to work with cross-functional teams.
  
  
  

Preferred Skills

• Experience with management and controls of Wafer level Taping process
• Familiarity with Minitab, Excel, Word and PowerPoint.
• Experience in project management is an advantage.
  
  
  

Others

• Ability to work in a fast-paced, dynamic environment and adapt to changing priorities.
  
  
  

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

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