Company:

Qualcomm India Private Limited

Job Area:

Engineering Group, Engineering Group > Software Engineering

Overview

General Summary:

• Power/Thermal Software products team at Qualcomm to achieve industry leading Power/Thermal/Limit SW management solution on Qualcomm Automotive, Compute, Mobile, IoT and AR/VR chipsets.
• In this position, the candidate will be working with cross-functional teams to Profile Power & Thermal and identify Power, thermal & Peak Current risks and provide optimized solutions with proper Mitigation.
• The candidate will need to perform system level analysis of Power/thermal use cases, expected to collaborate with Architecture, HW design, Performance, Power/Thermal Systems and various software teams to work towards optimal system level Power/thermal SW solution.
• In addition, the candidate will need to develop tools and methodologies for competitive analysis to learn about competitors strengths and weaknesses, and come up with thermal mitigations schemes that are best in the industry.
  
  
  

Minimum Qualifications

Bachelor's/Master’s degree in Engineering, Information Systems, Computer Science, or related field.

2+ years experience with Programming Language such as C, C++, Python, etc.

Preferred Qualifications

• Systems/HW background with a good understanding of microprocessor architecture and common SoC hardware blocks (Interconnects, Display, Graphics, etc.)
• Operating systems concepts - scheduling, memory management and device drivers
• Using debug tools like JTAG debugger, oscilloscopes, logic analyzers.
• Knowledge on Mobile power or Power/thermal management SW development
  
  
  

Minimum Qualifications:

• Bachelor's degree in Engineering, Information Systems, Computer Science, or related field.
  
  
  

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